Nothing Special   »   [go: up one dir, main page]

skip to main content
10.1145/240518.240519acmconferencesArticle/Chapter ViewAbstractPublication PagesdacConference Proceedingsconference-collections
Article
Free access

Package and interconnect modeling of the HFA3624, a 2.4GHz RF to IF converter

Published: 01 June 1996 Publication History
First page of PDF

References

[1]
R. E Harrington, Field Computation by Moment Methods. New York: MacMillan, 1968.
[2]
K. Nabors and J. White, "FastCap: A Multipole-Accelerated 3-D Capacitance Extraction Program," IEEE Trans. CAD, vol. 10 no. 10, November 1991, p1447-1459.
[3]
L. Greengard, The Rapid Evaluation of Potential Fields in Particle Systems.Cambridge, Massachusetts: M.I.T. Press, 1988.
[4]
M. Kamon, M. J. Tsuk, and J. White. Fasthenry: A multipoleaccelerated 3-d inductance extraction program. IEEE Transactions on Microwave Theory and Techniques, 42(9):1750-1758, September 1994.
[5]
S. Majors, Generating Bond Diagrams for Packaged IC Verification, Proceedings of the International Cadence Users Group Conference, Oct. 1994.
[6]
R. Lowther, P. Begley, G. Bajor, A. Rivoli: Substrate Parasitics and Dual-Resistivity Substrates. Submitted to IEEE Transactions on Microwave Theory and Techniques.
[7]
L.M. Silveira, M. Kamon, and J. White. Efficient Reduced- Order Modeling of Frequency-Dependent Coupling Inductances associated with 3-D Interconnect Structures In Proceedings of the 32nd ACM/IEEE Design Automation Conference, June 1995.

Cited By

View all
  • (2000)CAD techniques for robust RF and wireless IC design42nd Midwest Symposium on Circuits and Systems (Cat. No.99CH36356)10.1109/MWSCAS.1999.867211(68-71)Online publication date: 2000
  • (1997)Interconnect and substrate modeling and analysis: an overviewProceedings of the 1997 Bipolar/BiCMOS Circuits and Technology Meeting10.1109/BIPOL.1997.647425(158-165)Online publication date: 1997

Index Terms

  1. Package and interconnect modeling of the HFA3624, a 2.4GHz RF to IF converter

      Recommendations

      Comments

      Please enable JavaScript to view thecomments powered by Disqus.

      Information & Contributors

      Information

      Published In

      cover image ACM Conferences
      DAC '96: Proceedings of the 33rd annual Design Automation Conference
      June 1996
      839 pages
      ISBN:0897917790
      DOI:10.1145/240518
      Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

      Sponsors

      Publisher

      Association for Computing Machinery

      New York, NY, United States

      Publication History

      Published: 01 June 1996

      Permissions

      Request permissions for this article.

      Check for updates

      Qualifiers

      • Article

      Conference

      DAC96
      Sponsor:
      DAC96: The 33rd Design Automation Conference
      June 3 - 7, 1996
      Nevada, Las Vegas, USA

      Acceptance Rates

      DAC '96 Paper Acceptance Rate 142 of 377 submissions, 38%;
      Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

      Upcoming Conference

      DAC '25
      62nd ACM/IEEE Design Automation Conference
      June 22 - 26, 2025
      San Francisco , CA , USA

      Contributors

      Other Metrics

      Bibliometrics & Citations

      Bibliometrics

      Article Metrics

      • Downloads (Last 12 months)22
      • Downloads (Last 6 weeks)3
      Reflects downloads up to 25 Nov 2024

      Other Metrics

      Citations

      Cited By

      View all
      • (2000)CAD techniques for robust RF and wireless IC design42nd Midwest Symposium on Circuits and Systems (Cat. No.99CH36356)10.1109/MWSCAS.1999.867211(68-71)Online publication date: 2000
      • (1997)Interconnect and substrate modeling and analysis: an overviewProceedings of the 1997 Bipolar/BiCMOS Circuits and Technology Meeting10.1109/BIPOL.1997.647425(158-165)Online publication date: 1997

      View Options

      View options

      PDF

      View or Download as a PDF file.

      PDF

      eReader

      View online with eReader.

      eReader

      Login options

      Media

      Figures

      Other

      Tables

      Share

      Share

      Share this Publication link

      Share on social media