Cited By
View all- Sabry MAyala JAtienza D(2010)Thermal-Aware Compilation for Register Window-Based Embedded ProcessorsIEEE Embedded Systems Letters10.1109/LES.2010.20813432:4(103-106)Online publication date: 1-Dec-2010
Thermal-aware data flow analysis
Pages 613 - 614
Abstract
This paper suggests that the thermal state of a processor can be approximated using data flow analysis. The results of this analysis can be used to evaluate the efficacy of thermal-aware compilation strategies, or as input to thermal-aware optimizations that occur in the early stages of back-end compilation. We propose different ways how the exploitation of thermal behavior knowledge can be included in the different compilation phases.
References
[1]
Srinivasan, J., et al. Predictive dynamic thermal management for multimedia applications. In Proc. 17th ICS, pp. 109--120, 2003.
[2]
Atienza, D., et al. Reliability-aware design for nanometer-scale devices. In Proc. ASPDAC, pp. 549--554, 2008.
[3]
Zhou, X., et al. Compiler-driven register re-assignment for register file power-density and temperature reduction. In Proc. DAC, pp. 750--753, 2008.
[4]
Schafer, B. C., et al. Temperature-Aware Compilation for VLIW Processors. In Proc. RTCSA, pp. 426--431, 2007.
[5]
Atienza, D., et al. HW-SW emulation framework for temperature-aware design in MPSoCs. ACM TODAES, 12(3), pp. 1--26, August, 2007.
[6]
Cooper, K. D., and Torczon, L. Engineering a Compiler, Morgan-Kaufmann, San Francisco, CA, USA, 2003.
[7]
Stephenson, M., et al. Bitwidth analysis with application to silicon compilation, In Proc. of PLDI, pp. 108--120, 2000.
Index Terms
- Thermal-aware data flow analysis
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Published In
July 2009
994 pages
ISBN:9781605584973
DOI:10.1145/1629911
Copyright © 2009 ACM.
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- EDAC: Electronic Design Automation Consortium
- SIGDA: ACM Special Interest Group on Design Automation
- IEEE-CAS: Circuits & Systems
Publisher
Association for Computing Machinery
New York, NY, United States
Publication History
Published: 26 July 2009
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DAC '09
Sponsor:
- EDAC
- SIGDA
- IEEE-CAS
DAC '09: The 46th Annual Design Automation Conference 2009
July 26 - 31, 2009
California, San Francisco
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Overall Acceptance Rate 1,770 of 5,499 submissions, 32%
Upcoming Conference
DAC '25
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View all- Sabry MAyala JAtienza D(2010)Thermal-Aware Compilation for Register Window-Based Embedded ProcessorsIEEE Embedded Systems Letters10.1109/LES.2010.20813432:4(103-106)Online publication date: 1-Dec-2010
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