Article

Thermal response to DVFS: analysis with an Intel Pentium M

Authors:

Juan RubioAuthors Info & Claims

ISLPED '07: Proceedings of the 2007 international symposium on Low power electronics and design

Pages 219 - 224

https://doi.org/10.1145/1283780.1283827

Published: 27 August 2007 Publication History

Get Access

Abstract

Increasing power density in computing systems from laptops to servers has spurred interest in dynamic thermal management. Based on the success of dynamic voltage and frequency scaling (DVFS) in managing power and energy, DVFS may be a viable option for thermal management, as well. However, publicly available data on the thermal effects of DVFS are very limited. In this work, we characterize the thermal response of Intel Pentium M system to DVFS, identifying the response timescale and influence of factors beyond voltage and frequency on processor temperature.

References

[1]

Advanced Micro Devices. PowerNow with optimized power management, Jan. 2006.

Google Scholar

[2]

J. Clabes et al. Design and implementation of the POWER5 microprocessor. In Design Automation Conference (DAC), pages 670--672, 2004.

Digital Library

Google Scholar

[3]

J. Donald and M. Martonosi. Techniques for multicore thermal management: Classification and new exploration. In International Symposium on Computer Architecture (ISCA), pages 78--88, 2006.

Digital Library

Google Scholar

[4]

K. Flautner and T. Mudge. Vertigo: Automatic performance-setting for linux. In Operating Systems Design and Implementation (OSDI), pages 105--116, 2002.

Digital Library

Google Scholar

[5]

D. Genossar and N. Shamir. Intel Pentium M power estimation, budgeting, optimization, and validation. Intel Technology Journal, 7(2):44--49, May 2003.

Google Scholar

[6]

H. Hanson. Coordinated Power, Energy, and Temperature Management. PhD thesis, The University of Texas at Austin, 2007. Department of Computer Sciences Technical Report TR-07-29.

Digital Library

Google Scholar

[7]

Intel. Pentium M processor on 90 nm process with 2-MB L2 cache datasheet, January 2005.

Google Scholar

[8]

Intel Pentium 4 processor with 512-kb L2 cache on 0.13 micron process and Intel Pentium 4 processor extreme edition supporting hyper-threading technology datasheet.

Google Scholar

[9]

A. Nanduri. Dynamic Power Coordination. http://www.intel.com/products/processor/coreduo/dynamicpowercoordination.htm, 2006.

Google Scholar

[10]

LM85 hardware monitor with integrated fan control. http://www.national.com/ds.cgi/LM/LM85.pdf.

Google Scholar

[11]

Radisys Corporation. Endura LS855 product data sheet.

Google Scholar

[12]

K. Rajamani, H. Hanson, J. Rubio, S. Ghiasi, and F. Rawson. Application-aware power management. In International Symposium on Workload Characterization, pages 39--48, October 2006.

Crossref

Google Scholar

[13]

E. Rotem, A. Naveh, M. Moffie, and A. Mendelson. Analysis of thermal monitor features of the Intel Pentium M processor. In Workshop on Temperature Aware Computer Systems, June 2004.

Google Scholar

Cited By

View all

Zhang TLi WLi JWei LLiu J(2024)A 700nW Compact Temperature Sensor With a One-Point Trimmed Inaccuracy of +1.2/−1.0 °C for On-Chip Thermal MonitoringIEEE Transactions on Circuits and Systems II: Express Briefs10.1109/TCSII.2024.337018371:8(3675-3679)Online publication date: Aug-2024
https://doi.org/10.1109/TCSII.2024.3370183
Chen KLiao YChen CWang L(2023)Adaptive Machine Learning-Based Proactive Thermal Management for NoC SystemsIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2023.328296931:8(1114-1127)Online publication date: Aug-2023
https://doi.org/10.1109/TVLSI.2023.3282969
Yao Y(2023)Game-of-Life Temperature-Aware DVFS Strategy for Tile-Based Chip Many-Core ProcessorsIEEE Journal on Emerging and Selected Topics in Circuits and Systems10.1109/JETCAS.2023.324476313:1(58-72)Online publication date: Mar-2023
https://doi.org/10.1109/JETCAS.2023.3244763
Show More Cited By

Index Terms

Thermal response to DVFS: analysis with an Intel Pentium M
1. Hardware

Recommendations

T-DVS: Temperature-aware DVS based on Temperature Inversion Phenomenon
ISLPED '16: Proceedings of the 2016 International Symposium on Low Power Electronics and Design

Dynamic Voltage and Frequency Scaling (DVFS) is a widely used methodology to reduce the power consumption of mobile devices. This scheme performs frequency scaling in accordance with a specific governor and sets an operating voltage to be paired with ...
Temperature and supply Voltage aware performance and power modeling at microarchitecture level

Performance and power are two primary design issues for systems ranging from server computers to handhelds. Performance is affected by both temperature and supply voltage because of the temperature and voltage dependence of circuit delay. Furthermore, ...
Recent thermal management techniques for microprocessors

Microprocessor design has recently encountered many constraints such as power, energy, reliability, and temperature. Among these challenging issues, temperature-related issues have become especially important within the past several years. We summarize ...

Comments

Please enable JavaScript to view thecomments powered by Disqus.

Information & Contributors

Information

Published In

ISLPED '07: Proceedings of the 2007 international symposium on Low power electronics and design

August 2007

432 pages

ISBN:9781595937094

DOI:10.1145/1283780

General Chairs:
Diana Marculescu
Carnegie Mellon University
,
Anand Raghunathan
NEC Laboratories America
,
Program Chairs:
Ali Keshavarzi
Intel Corporation
,
Vijaykrishnan Narayanan
Penn State University

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

Publisher

Association for Computing Machinery

New York, NY, United States

Publication History

Published: 27 August 2007

Permissions

Request permissions for this article.

Request Permissions

Check for updates

Author Tags

Qualifiers

Article

Conference

ISLPED07

Sponsor:

ISLPED07: International Symposium on Low Power Electronics and Design

August 27 - 29, 2007

OR, Portland, USA

Acceptance Rates

Overall Acceptance Rate 398 of 1,159 submissions, 34%

Contributors

Other Metrics

View Article Metrics

Bibliometrics & Citations

Bibliometrics

Article Metrics

67
Total Citations
View Citations
1,123
Total Downloads

Downloads (Last 12 months)14
Downloads (Last 6 weeks)0

Reflects downloads up to 18 Nov 2024

Other Metrics

View Author Metrics

Citations

Cited By

View all

Zhang TLi WLi JWei LLiu J(2024)A 700nW Compact Temperature Sensor With a One-Point Trimmed Inaccuracy of +1.2/−1.0 °C for On-Chip Thermal MonitoringIEEE Transactions on Circuits and Systems II: Express Briefs10.1109/TCSII.2024.337018371:8(3675-3679)Online publication date: Aug-2024
https://doi.org/10.1109/TCSII.2024.3370183
Chen KLiao YChen CWang L(2023)Adaptive Machine Learning-Based Proactive Thermal Management for NoC SystemsIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2023.328296931:8(1114-1127)Online publication date: Aug-2023
https://doi.org/10.1109/TVLSI.2023.3282969
Yao Y(2023)Game-of-Life Temperature-Aware DVFS Strategy for Tile-Based Chip Many-Core ProcessorsIEEE Journal on Emerging and Selected Topics in Circuits and Systems10.1109/JETCAS.2023.324476313:1(58-72)Online publication date: Mar-2023
https://doi.org/10.1109/JETCAS.2023.3244763
Durairaj SSridhar R(2023)MOM-VMP: multi-objective mayfly optimization algorithm for VM placement supported by principal component analysis (PCA) in cloud data centerCluster Computing10.1007/s10586-023-04040-827:2(1733-1751)Online publication date: 5-Jun-2023
https://doi.org/10.1007/s10586-023-04040-8
Li XYan GLiu CLi XYan GLiu C(2023)Fault-Tolerant General Purposed ProcessorsBuilt-in Fault-Tolerant Computing Paradigm for Resilient Large-Scale Chip Design10.1007/978-981-19-8551-5_3(117-168)Online publication date: 2-Mar-2023
https://doi.org/10.1007/978-981-19-8551-5_3
Zhou ZLi KAbawajy JShojafar MChowdhury MLi FLi K(2022)An Adaptive Energy-Aware Stochastic Task Execution Algorithm in Virtualized Networked DatacentersIEEE Transactions on Sustainable Computing10.1109/TSUSC.2021.31153887:2(371-385)Online publication date: 1-Apr-2022
https://doi.org/10.1109/TSUSC.2021.3115388
Maity SRoy RMajumder ADey SHota A(2022)Future aware Dynamic Thermal Management in CPU-GPU Embedded Platforms2022 IEEE Real-Time Systems Symposium (RTSS)10.1109/RTSS55097.2022.00041(396-408)Online publication date: Dec-2022
https://doi.org/10.1109/RTSS55097.2022.00041
Lin WChen CHsieh CLi JFang EHsueh S(2022) ML-Assisted V min Binning with Multiple Guard Bands for Low Power Consumption 2022 IEEE International Test Conference (ITC)10.1109/ITC50671.2022.00029(213-218)Online publication date: Sep-2022
https://doi.org/10.1109/ITC50671.2022.00029
Haj-Yahya JKim JYağlikçi APuddu IOrosa LLuna JAlser MMutlu OMartínez JDuato JJohn L(2021)IChannelsProceedings of the 48th Annual International Symposium on Computer Architecture10.1109/ISCA52012.2021.00081(985-998)Online publication date: 14-Jun-2021
https://dl.acm.org/doi/10.1109/ISCA52012.2021.00081
Zhang TLi WXiao JLiu J(2021)Thermal field reconstruction based on weighted dictionary learningIET Circuits, Devices & Systems10.1049/cds2.1209816:3(228-239)Online publication date: 16-Sep-2021
https://doi.org/10.1049/cds2.12098
Show More Cited By

View Options

Login options

Check if you have access through your login credentials or your institution to get full access on this article.

Cited By

Index Terms

Recommendations

T-DVS: Temperature-aware DVS based on Temperature Inversion Phenomenon

Temperature and supply Voltage aware performance and power modeling at microarchitecture level

Recent thermal management techniques for microprocessors