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Evaluation of on-chip transmission line interconnect using wire length distribution

Authors:

Kazuya MasuAuthors Info & Claims

ASP-DAC '05: Proceedings of the 2005 Asia and South Pacific Design Automation Conference

Pages 133 - 138

https://doi.org/10.1145/1120725.1120789

Published: 18 January 2005 Publication History

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Abstract

On-chip transmission-line interconnect has been proposed to reduce delay time and power consumption. The transmission line is used to replace long RC interconnects. This paper proposes the methodology to replace RC lines with transmission lines, which are estimated with Wire Length Distribution (WLD). Advantages of on-chip transmission line are discussed from the view point of delay time and power consumption.

References

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H. Ito, K. Nakamura, K. Okada and K. Masu, "High Density Differential Transmission Line Structure on Si USLI", IEICE Transactions on Electronics, Vol. E87-C, No. 6, pp. 942--948, June 2004.

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Cited By

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Okada KUezono TMasu K(2006)Estimation of power reduction by on-chip transmission line for 45nm technologyProceedings of the 16th international conference on Integrated Circuit and System Design: power and Timing Modeling, Optimization and Simulation10.1007/11847083_18(181-190)Online publication date: 13-Sep-2006
https://dl.acm.org/doi/10.1007/11847083_18
Flynn MKang J(2005)Global signaling over lossy transmission linesProceedings of the 2005 IEEE/ACM International conference on Computer-aided design10.5555/1129601.1129740(985-992)Online publication date: 31-May-2005
https://dl.acm.org/doi/10.5555/1129601.1129740
Uezono TInoue JKyogoku TOkada KMasu KMarkov IHutton M(2005)Prediction of delay time for future LSI using on-chip transmission line interconnectsProceedings of the 2005 international workshop on System level interconnect prediction10.1145/1053355.1053359(7-12)Online publication date: 2-Apr-2005
https://dl.acm.org/doi/10.1145/1053355.1053359

Evaluation of on-chip transmission line interconnect using wire length distribution
1. Hardware

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Information & Contributors

Information

Published In

ASP-DAC '05: Proceedings of the 2005 Asia and South Pacific Design Automation Conference

January 2005

1495 pages

ISBN:0780387376

DOI:10.1145/1120725

General Chair:
Ting-Ao Tang
Fudan University, Shanghai, P. R. China

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Association for Computing Machinery

New York, NY, United States

Publication History

Published: 18 January 2005

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ASPDAC05

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SIGDA

ASPDAC05: Asia and South Pacific Design Automation Conference

January 18 - 21, 2005

Shanghai, China

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Overall Acceptance Rate 466 of 1,454 submissions, 32%

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Okada KUezono TMasu K(2006)Estimation of power reduction by on-chip transmission line for 45nm technologyProceedings of the 16th international conference on Integrated Circuit and System Design: power and Timing Modeling, Optimization and Simulation10.1007/11847083_18(181-190)Online publication date: 13-Sep-2006
https://dl.acm.org/doi/10.1007/11847083_18
Flynn MKang J(2005)Global signaling over lossy transmission linesProceedings of the 2005 IEEE/ACM International conference on Computer-aided design10.5555/1129601.1129740(985-992)Online publication date: 31-May-2005
https://dl.acm.org/doi/10.5555/1129601.1129740
Uezono TInoue JKyogoku TOkada KMasu KMarkov IHutton M(2005)Prediction of delay time for future LSI using on-chip transmission line interconnectsProceedings of the 2005 international workshop on System level interconnect prediction10.1145/1053355.1053359(7-12)Online publication date: 2-Apr-2005
https://dl.acm.org/doi/10.1145/1053355.1053359

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