Thermal optimal task allocation algorithm for multi-core 3D IC with interlayer cooling system

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Wei Guo, National Laboratory for Parallel and Distributed Processing, National University of Defense Technology">Minxuan Zhang, Chaoyun Yao, Peng Li, Chaochao Feng, Hongwei Zhou

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Keywords: 3D IC, interlayer cooling, task allocation, simulated annealing, thermal

JOURNAL FREE ACCESS

2016 Volume 13 Issue 1 Pages 20150970

DOI https://doi.org/10.1587/elex.12.20150970

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Abstract

Multi-core 3D IC is a new solution for greater quantity of cores, but with critical challenge of internal thermal. The interlayer cooling system is introduced for this problem, and expends the design space of task allocation. This work proposes a thermal optimal task allocation algorithm for multi-core 3D IC with interlayer cooling system, integrated with simulated annealing method. The results show that the maximal temperature and temperature gradient reduced by 19.4 °C and 5.1 °C respectively, compared to the randomized policy, and obtain better balance between normal and extreme cases than traditional ranking policy, in a design of 3 active device layers.

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