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"The Research on Non-destructive Testing Method of Sheet Resistance in ..."

Xinfu Liu et al. (2008)

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DOI: 10.1109/IIH-MSP.2008.286

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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  - conf/iih-msp/LiuLDZZH08
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  - https://dblp.org/rec/conf/iih-msp/LiuLDZZH08
Xinfu Liu, Jinhe Liu, Zhanping Du, Quanming Zhao, Junying Zhao, Yuhui Huang:
The Research on Non-destructive Testing Method of Sheet Resistance in Micro Area of Silicon Wafer Based on EIT Technology. IIH-MSP 2008: 1494-1497

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