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Steve Lipa
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2020 – today
- 2022
- [j2]Theodros Nigussie
, Joshua Schabel
Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning. IEEE Trans. Very Large Scale Integr. Syst. 30(9): 1230-1243 (2022)
2010 – 2019
- 2019
- [c12]T. Robert Harris, W. Rhett Davis
Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages. 3DIC 2019: 1-3 - 2017
- [c11]Vinesh Srinivasan, Rangeen Basu Roy Chowdhury, Elliott Forbes, Randy Widialaksono, Zhenqian Zhang, Joshua Schabel, Sungkwan Ku, Steve Lipa, Eric Rotenberg, W. Rhett Davis
H3 (Heterogeneity in 3D): A Logic-on-Logic 3D-Stacked Heterogeneous Multi-Core Processor. ICCD 2017: 145-152 - 2016
- [c10]Randy Widialaksono, Rangeen Basu Roy Chowdhury, Zhenqian Zhang, Joshua Schabel, Steve Lipa, Eric Rotenberg, W. Rhett Davis, Paul D. Franzon
Physical design of a 3D-stacked heterogeneous multi-core processor. 3DIC 2016: 1-5 - 2015
- [c9]Paul D. Franzon
Computing in 3D. 3DIC 2015: TS6.1.1-TS6.1.2 - [c8]Paul D. Franzon
Computing in 3D. CICC 2015: 1-6 - [c7]Elliott Forbes, Zhenqian Zhang, Randy Widialaksono, Brandon H. Dwiel, Rangeen Basu Roy Chowdhury, Vinesh Srinivasan, Steve Lipa, Eric Rotenberg, W. Rhett Davis, Paul D. Franzon:
Under 100-cycle thread migration latency in a single-ISA heterogeneous multi-core processor. Hot Chips Symposium 2015: 1 - 2014
- [c6]Paul D. Franzon
3D-enabled customizable embedded computer (3DECC). 3DIC 2014: 1-3 - 2013
- [c5]Eric Rotenberg, Brandon H. Dwiel, Elliott Forbes, Zhenqian Zhang, Randy Widialaksono, Rangeen Basu Roy Chowdhury, Nyunyi M. Tshibangu, Steve Lipa, W. Rhett Davis
Rationale for a 3D heterogeneous multi-core processor. ICCD 2013: 154-168 - [c4]Paul D. Franzon
Exploring early design tradeoffs in 3DIC. ISCAS 2013: 545-549 - 2012
- [c3]Thorlindur Thorolfsson, Steve Lipa, Paul D. Franzon
A 10.35 mW/GFlop stacked SAR DSP unit using fine-grain partitioned 3D integration. CICC 2012: 1-4 - 2010
- [c2]Steve Lipa, Thorlindur Thorolfsson, Paul D. Franzon
The NCSU Tezzaron design kit. 3DIC 2010: 1-15
2000 – 2009
- 2008
- [c1]Paul D. Franzon
Design and CAD for 3D integrated circuits. DAC 2008: 668-673 - 2001
- [j1]John Wood, Terence C. Edwards, Steve Lipa:
Rotary traveling-wave oscillator arrays: a new clock technology. IEEE J. Solid State Circuits 36(11): 1654-1665 (2001)
Coauthor Index
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