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"Cost-effective temporary bonding and debonding material solution towards ..."

Yann Civale et al. (2013)

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DOI: 10.1109/3DIC.2013.6702330

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  - https://dblp.org/rec/conf/3dic/CivaleMJFYWKRL13
Yann Civale, Herman Meynen, Ranjith S. E. John, Peng-Fei Fu, Craig R. Yeakle, Sheng Wang, Stefan Krausse, Thomas Rapps, Stefan Lutter:
Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits. 3DIC 2013: 1-5

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