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Andy Miller
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2020 – today
- 2024
- [c12]Pengfei Xu, Junwen He, Koen Kennes, Anton Dvoretskii, Arnita Podpod, Guy Lepage, Negin Golshani, Rafal Magdziak, Swetanshu Bipul, Dieter Bode, Peter Verheyen, Maumita Chakrabarti, Dimitrios Velenis, Andy Miller, Yoojin Ban, Filippo Ferraro, Joris Van Campenhout:
Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer. OFC 2024: 1-3 - [c11]Pengfei Xu, Chiara Marchese, Guy Lepage, Negin Golshani, Ruben Van Eenaeme, Andrea Mingardi, Joost Van Ongeval, Rafal Magdziak, Luc Halipre, Darko Trivkovic, Peter Verheyen, Maumita Chakrabarti, Dimitrios Velenis, Andy Miller, Filippo Ferraro, Yoojin Ban, Joris Van Campenhout:
Low-loss, multi-reticle stitched SiN waveguides for 300mm wafer-level optical interconnects. OFC 2024: 1-3
2010 – 2019
- 2019
- [c10]Dimitrios Velenis, Joeri De Vos, Soon-Wook Kim, Jaber Derakhshandeh, Pieter Bex, Giovanni Capuz, Samuel Suhard, Kenneth June Rebibis, Stefaan Van Huylenbroeck, Erik Jan Marinissen, Alain Phommahaxay, Andy Miller, Gerald Beyer, Geert Van der Plas, Eric Beyne
:
Process Complexity and Cost Considerations of Multi-Layer Die Stacks. 3DIC 2019: 1-6 - 2018
- [c9]Joris Van Campenhout, Yoojin Ban, Peter De Heyn, Ashwyn Srinivasan, Jeroen De Coster, Sebastien Lardenois, Brad Snyder, Sadhishkumar Balakrishnan, Guy Lepage, Negin Golshani, Sofie Janssen, Alicja Lesniewska, Kristof Croes, Andy Miller, Peter Verheyen, Marianna Pantouvaki, Philippe Absil:
Silicon Photonics for 56G NRZ Optical Interconnects. OFC 2018: 1-3 - [c8]Bradley Snyder, Nivesh Mangal, Guy Lepage, Sadhishkumar Balakrishnan, Xiao Sun, Nicolas Pantano, Michal Rakowski, Lieve Bogaerts, Peter De Heyn, Peter Verheyen, Andy Miller, Marianna Pantouvaki, Philippe Absil, Joris Van Campenhout:
Packaging and Assembly Challenges for 50G Silicon Photonics Interposers. OFC 2018: 1-3 - 2016
- [c7]Jaber Derakhshandeh, Lin Hou, Inge De Preter, Carine Gerets, Samuel Suhard, Vikas Dubey
Die to wafer 3D stacking for below 10um pitch microbumps. 3DIC 2016: 1-4 - [c6]Anne Jourdain, Joeri De Vos, Fumihiro Inoue
Extreme wafer thinning optimization for via-last applications. 3DIC 2016: 1-5 - [c5]Joeri De Vos, Lan Peng, Alain Phommahaxay, Joost Van Ongeval, Andy Miller, Eric Beyne
Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects. 3DIC 2016: 1-5 - 2015
- [c4]Dimitrios Velenis, Mikael Detalle, Geert Hellings, Mirko Scholz, Erik Jan Marinissen
Processing active devices on Si interposer and impact on cost. 3DIC 2015: TS11.2.1-TS11.2.4 - [c3]Soon-Wook Kim, Lan Peng, Andy Miller, Gerald Beyer, Eric Beyne
Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics. 3DIC 2015: TS7.2.1-TS7.2.4 - 2013
- [j3]Andy Miller:
Trees of integral triangles with given rectangular defect. Discret. Math. 313(1): 50-66 (2013) - 2011
- [c2]Sandip Halder
In-line metrology and inspection for process control during 3D stacking of IC's. 3DIC 2011: 1-4 - [c1]Alain Phommahaxay, Anne Jourdain, Greet Verbinnen, Tobias Woitke, Peter Bisson, Markus Gabriel, Walter Spiess, Alice Guerrero, Jeremy McCutcheon, Rama Puligadda, Pieter Bex, Axel Van den Eede, Bart Swinnen, Gerald Beyer, Andy Miller, Eric Beyne
Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding. 3DIC 2011: 1-4 - 2010
- [j2]Jeremy Louis Marzuola, Andy Miller:
Counting numerical sets with no small atoms. J. Comb. Theory A 117(6): 650-667 (2010)
1990 – 1999
- 1999
- [j1]Matt Compton, Andy Miller:
Generating Functions for Actions on Handlebodies with Genus Zero Quotient. J. Comb. Theory A 87(1): 151-174 (1999)
Coauthor Index
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last updated on 2024-06-10 20:32 CEST by the dblp team
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