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Microelectronics Reliability, Volume 70

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Volume 70, March 2017

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Seyed Amir Paknejad, Samjid H. Mannan:
Review of silver nanoparticle based die attach materials for high power/temperature applications. 1-11
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Yusuke Higashi, Riichiro Takaishi, Koichi Kato, Masamichi Suzuki, Yasushi Nakasaki, Mitsuhiro Tomita, Yuichiro Mitani, Masuaki Matsumoto, Shohei Ogura, Katsuyuki Fukutani, Kikuo Yamabe:
Mechanism of gate dielectric degradation by hydrogen migration from the cathode interface. 12-21
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  - journals/mr/HassanR17
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Mohammad Khaled Hassan, Kaushik Roy:
Investigation of dependence between time-zero and time-dependent variability in high-κ NMOS transistors. 22-31
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Patrick G. Whiting, M. R. Holzworth, A. G. Lind, Stephen J. Pearton, Kevin S. Jones, Lu Liu, T. S. Kang, Fan Ren, Y. Xin:
Erosion defect formation in Ni-gate AlGaN/GaN high electron mobility transistors. 32-40
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Patrick G. Whiting, Nicholas G. Rudawski, M. R. Holzworth, Stephen J. Pearton, Kevin S. Jones, Lu Liu, T. S. Kang, Fan Ren:
Nanocrack formation in AlGaN/GaN high electron mobility transistors utilizing Ti/Al/Ni/Au ohmic contacts. 41-48
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  - journals/mr/XiongGYHNLSXL17
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Huaping Xiong, Chuanhai Gan, Xiaobing Yang, Zhigang Hu, Haiyan Niu, Jianfeng Li, Jianfang Si, Pengfei Xing, Xuetao Luo:
Corrosion behavior of crystalline silicon solar cells. 49-58
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Xiaohong Su, Shuai Wang, Michael G. Pecht, Lingling Zhao, Zhe Ye:
Interacting multiple model particle filter for prognostics of lithium-ion batteries. 59-69
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Fangfang Yang, Dong Wang, Yinjiao Xing, Kwok-Leung Tsui:
Prognostics of Li(NiMnCo)O₂-based lithium-ion batteries using a novel battery degradation model. 70-78
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Abderrahmane Baïri, Luís M. Roseiro, Alexander Martín-Garín, Kemi Adeyeye, J. A. Millán-García:
Thermal state of electronic assemblies applied to smart building equipped with QFN64 device subjected to natural convection. 79-83
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  - journals/mr/Khoshvaght-Aliabadi17
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Morteza Khoshvaght-Aliabadi, Seyedmasoud Hassani, Seyed Hossein Mazloumi:
Comparison of hydrothermal performance between plate fins and plate-pin fins subject to nanofluid-cooled corrugated miniature heat sinks. 84-96
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Yuanxing Pan, Fei Li, Hu He, Junhui Li, Wenhui Zhu:
Effects of dimension parameters and defect on TSV thermal behavior for 3D IC packaging. 97-102
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  - journals/mr/DiyarogluOOMHH17
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Cagan Diyaroglu, Selda Oterkus, Erkan Oterkus, Erdogan Madenci, S. Han, Y. Hwang:
Peridynamic wetness approach for moisture concentration analysis in electronic packages. 103-111
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Chenglin Yang, Ruoshan Su, Bing Long:
Methods of sequential test optimization in dynamic environment. 112-121
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Chong Leong Gan, Mohamad Zainudeen Moideen:
Book Review: Carbon Nanotubes for Interconnects: Process, Design and Applications (2017), Springer, ISBN: ISBN 978-3-319-29744-6 (Print) ISBN 978-3-319-29746-0 (Online). 122-123

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