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"Multi-Objective Module Placement For 3-D System-On-Package."

Eric Wong, Jacob R. Minz, Sung Kyu Lim (2006)

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DOI: 10.1109/TVLSI.2006.876111

access: closed

type: Journal Article

metadata version: 2022-10-02

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  - https://dblp.org/rec/journals/tvlsi/WongML06
Eric Wong, Jacob R. Minz, Sung Kyu Lim:
Multi-Objective Module Placement For 3-D System-On-Package. IEEE Trans. Very Large Scale Integr. Syst. 14(5): 553-557 (2006)

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