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"Yield Enhancement of Face-to-Face Cu-Cu Bonding With Dual-Mode ..."

Myat Thu Linn Aung et al. (2017)

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DOI: 10.1109/TVLSI.2016.2623659

access: closed

type: Journal Article

metadata version: 2021-10-14

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  - journals/tvlsi/AungYTK17
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  - https://dblp.org/rec/journals/tvlsi/AungYTK17
Myat Thu Linn Aung, Takefumi Yoshikawa, Chuan Seng Tan, Tony Tae-Hyoung Kim:
Yield Enhancement of Face-to-Face Cu-Cu Bonding With Dual-Mode Transceivers in 3DICs. IEEE Trans. Very Large Scale Integr. Syst. 25(3): 1023-1031 (2017)

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