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"A Method for Separation of Power Semiconductor Packaging-Related Wear-Out ..."

Yingzhou Peng, Haoran Wang, Huai Wang (2024)

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DOI: 10.1109/TIE.2023.3273269

access: closed

type: Journal Article

metadata version: 2023-11-09

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Yingzhou Peng, Haoran Wang, Huai Wang:
A Method for Separation of Power Semiconductor Packaging-Related Wear-Out Mechanisms Under Converter Operation. IEEE Trans. Ind. Electron. 71(4): 4201-4209 (2024)

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