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"A Pulse Shrinking-Based Test Solution for Prebond Through Silicon via in ..."

Maoxiang Yi et al. (2019)

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DOI: 10.1109/TCAD.2018.2821559

access: closed

type: Journal Article

metadata version: 2020-09-24

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  - https://dblp.org/rec/journals/tcad/YiBNJCL19
Maoxiang Yi, Jingchang Bian, Tianming Ni, Cuiyun Jiang, Hao Chang, Huaguo Liang:
A Pulse Shrinking-Based Test Solution for Prebond Through Silicon via in 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 38(4): 755-766 (2019)

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