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"TSF3D: MSV-Driven Power Optimization for Application-Specific 3D ..."

Kan Wang, Sheqin Dong, Fengxian Jiao (2017)

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DOI: 10.1109/TCAD.2017.2650989

access: closed

type: Journal Article

metadata version: 2020-09-24

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  - https://dblp.org/rec/journals/tcad/WangDJ17
Kan Wang, Sheqin Dong, Fengxian Jiao:
TSF3D: MSV-Driven Power Optimization for Application-Specific 3D Network-on-Chip. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(7): 1089-1102 (2017)

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