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"Enhancing the ductility and mechanical behavior of Sn-1.0Ag-0.5Cu ..."

Ahmed E. Hammad (2018)

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DOI: 10.1016/J.MICROREL.2018.06.015

access: closed

type: Journal Article

metadata version: 2024-09-17

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Ahmed E. Hammad:
Enhancing the ductility and mechanical behavior of Sn-1.0Ag-0.5Cu lead-free solder by adding trace amount of elements Ni and Sb. Microelectron. Reliab. 87: 133-141 (2018)

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