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"Coupling effects of mechanical vibrations and thermal cycling on ..."

Ying Ding et al. (2015)

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DOI: 10.1016/J.MICROREL.2015.06.118

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - journals/mr/DingTWHYZMT15
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  - https://dblp.org/rec/journals/mr/DingTWHYZMT15
Ying Ding, Ruyu Tian, Xiuli Wang, Chunjin Hang, Fang Yu, Ling Zhou, Xiangang Meng, Yanhong Tian:
Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGA solder joints. Microelectron. Reliab. 55(11): 2396-2402 (2015)

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