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"Microstructure evolution and mechanical strength evaluation in Ag/Sn/Cu ..."

Qiang Guo et al. (2018)

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DOI: 10.1016/J.MICROREL.2017.12.001

access: closed

type: Journal Article

metadata version: 2023-09-30

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  - https://dblp.org/rec/journals/mr/GuoSZCL18
Qiang Guo, Siyu Sun, Zhihao Zhang, Hongtao Chen, Mingyu Li:
Microstructure evolution and mechanical strength evaluation in Ag/Sn/Cu TLP bonding interconnection during aging test. Microelectron. Reliab. 80: 144-148 (2018)

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