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"3-D System Integration of Processor and Multi-Stacked SRAMs Using ..."

Makoto Saen et al. (2010)

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DOI: 10.1109/JSSC.2010.2040310

access: closed

type: Journal Article

metadata version: 2023-03-21

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  - https://dblp.org/rec/journals/jssc/SaenOONSSKKNIHHK10
Makoto Saen, Kenichi Osada, Yasuyuki Okuma, Kiichi Niitsu, Yasuhisa Shimazaki, Yasufumi Sugimori, Yoshinori Kohama, Kazutaka Kasuga, Itaru Nonomura, Naohiko Irie, Toshihiro Hattori, Atsushi Hasegawa, Tadahiro Kuroda:
3-D System Integration of Processor and Multi-Stacked SRAMs Using Inductive-Coupling Link. IEEE J. Solid State Circuits 45(4): 856-862 (2010)

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