default search action
"Transient thermal analysis of packaged SiC SBDs for high temperature ..."
Taehwa Kim, Tsuyoshi Funaki (2016)
- Taehwa Kim, Tsuyoshi Funaki:
Transient thermal analysis of packaged SiC SBDs for high temperature operation. IEICE Electron. Express 13(6): 20151047 (2016)
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.
last updated on 2021-02-12 22:20 CET by the dblp team
all metadata released as open data under CC0 1.0 license
see also: Terms of Use | Privacy Policy | Imprint
dblp was originally created in 1993 at:
since 2018, dblp has been operated and maintained by:
the dblp computer science bibliography is funded and supported by: