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"Plated-Through-Hole Via Design Specifications for 112G Serial Links."

Michael J. Degerstrom et al. (2023)

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DOI: 10.48550/ARXIV.2304.01913

access: open

type: Informal or Other Publication

metadata version: 2023-04-17

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  - electronic edition via DOI (open access)
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  dblp key:
  - journals/corr/abs-2304-01913
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  persistent URL:
  - https://dblp.org/rec/journals/corr/abs-2304-01913
Michael J. Degerstrom, Chad M. Smutzer, Richard B. Ericson, Clifton R. Haider, Barry K. Gilbert:
Plated-Through-Hole Via Design Specifications for 112G Serial Links. CoRR abs/2304.01913 (2023)

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