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"Performance and power analysis of through silicon via based 3D IC integration."

Hung Viet Nguyen, Myunghwan Ryu, Youngmin Kim (2011)

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DOI: 10.1109/SLIP.2011.6135439

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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Hung Viet Nguyen, Myunghwan Ryu, Youngmin Kim:
Performance and power analysis of through silicon via based 3D IC integration. SLIP 2011: 1

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