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"Expanded-Beam Through-Substrate Coupling Interface for Alignment Tolerant ..."

Nivesh Mangal et al. (2018)

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DOI: —

access: closed

type: Conference or Workshop Paper

metadata version: 2021-08-11

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  - electronic edition @ ieee.org
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  dblp key:
  - conf/ofc/MangalMRCSS18
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  persistent URL:
  - https://dblp.org/rec/conf/ofc/MangalMRCSS18
Nivesh Mangal, Jeroen Missinne, Gunther Roelkens, Joris Van Campenhout, Geert Van Steenberge, Brad Snyder:
Expanded-Beam Through-Substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics. OFC 2018: 1-3

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