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"A Reconfigurable Power System-in-Package Module using GaN HEMTs and IC ..."

Van Ha Nguyen et al. (2022)

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DOI: 10.1109/NEWCAS52662.2022.9842234

access: closed

type: Conference or Workshop Paper

metadata version: 2024-05-07

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  - conf/newcas/NguyenANPCBC22
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Van Ha Nguyen, Nueraimaiti Aimaier, Gabriel Nobert, Tan Pham, Nicolas G. Constantin, Yves Blaquière, Glenn E. R. Cowan:
A Reconfigurable Power System-in-Package Module using GaN HEMTs and IC Bare Dies on LTCC Substrate: Design - Implementation - Experiment and Future Directions. NEWCAS 2022: 188-192

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