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"Electrical modeling of Copper and Mixed Carbon bundles as a composite for ..."

Madhav Rao (2020)

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DOI: 10.1109/NEMS50311.2020.9265633

access: closed

type: Conference or Workshop Paper

metadata version: 2020-12-03

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Madhav Rao:
Electrical modeling of Copper and Mixed Carbon bundles as a composite for 3D Interconnect applications. NEMS 2020: 495-499

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