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"Photonic Interconnects for Interposer-based 2.5D/3D Integrated Systems on ..."

Paolo Grani et al. (2016)

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DOI: 10.1145/2989081.2989111

access: closed

type: Conference or Workshop Paper

metadata version: 2022-04-09

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Paolo Grani, Roberto Proietti, Venkatesh Akella, S. J. Ben Yoo:
Photonic Interconnects for Interposer-based 2.5D/3D Integrated Systems on a Chip. MEMSYS 2016: 377-386

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