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"Analysis of TDDB lifetime projection in low thermal budget HfO2/SiO2 ..."

Andrea Vici et al. (2023)

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DOI: 10.1109/IRPS48203.2023.10117955

access: closed

type: Conference or Workshop Paper

metadata version: 2023-05-24

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  dblp key:
  - conf/irps/ViciDRFKW23
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  - https://dblp.org/rec/conf/irps/ViciDRFKW23
Andrea Vici, Robin Degraeve, Philippe J. Roussel, Jacopo Franco, Ben Kaczer, Ingrid De Wolf:
Analysis of TDDB lifetime projection in low thermal budget HfO2/SiO2 stacks for sequential 3D integrations. IRPS 2023: 1-7

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