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"Future on-chip interconnect metallization and electromigration."

Chao-Kun Hu et al. (2018)

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DOI: 10.1109/IRPS.2018.8353597

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-08

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  - conf/irps/HuKHMSOCPPASQGB18
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  - https://dblp.org/rec/conf/irps/HuKHMSOCPPASQGB18
Chao-Kun Hu, James J. Kelly, Huai Huang, Koichi Motoyama, Hosadurga Shobha, Yuri Ostrovski, James H.-C. Chen, Raghuveer Patlolla, Brown Peethala, Praneet Adusumilli, Terry A. Spooner, Roger Quon, Lynne M. Gignac, Chris M. Breslin, G. Lian, M. Ali, Jacob Benedict, X. S. Lin, S. Smith, Vimal Kamineni, X. Zhang, Frank Wilhelm Mont, Shariq Siddiqui, Frieder H. Baumann:
Future on-chip interconnect metallization and electromigration. IRPS 2018: 4

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