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"Thermal Aware Module Placement for Heterogeneous 3D-IC Based FPGAs."

Alexander Wold, Dirk Koch, Jim Tørresen (2013)

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DOI: 10.1109/IPDPSW.2013.32

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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Alexander Wold, Dirk Koch, Jim Tørresen:
Thermal Aware Module Placement for Heterogeneous 3D-IC Based FPGAs. IPDPS Workshops 2013: 281-286

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