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"SOI, interconnect, package, and mainboard thermal characterization."

Joseph Nayfach-Battilana, Jose Renau (2009)

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DOI: 10.1145/1594233.1594314

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-06

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  dblp key:
  - conf/islped/Nayfach-BattilanaR09
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  - https://dblp.org/rec/conf/islped/Nayfach-BattilanaR09
Joseph Nayfach-Battilana, Jose Renau:
SOI, interconnect, package, and mainboard thermal characterization. ISLPED 2009: 327-330

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