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"Modeling and analysis of signal transmission with Through Silicon Via ..."

Zhenyang Chen et al. (2013)

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DOI: 10.1109/ISCAS.2013.6572422

access: closed

type: Conference or Workshop Paper

metadata version: 2022-06-22

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Zhenyang Chen, Qin Wang, Jing Xie, Jin Tian, Jianfei Jiang, Yufei Li, Wen Yin:
Modeling and analysis of signal transmission with Through Silicon Via (TSV) noise coupling. ISCAS 2013: 2646-2649

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