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"Die matching algorithm for enhancing parametric yield of 3D ICs."

Sangdo Park, Taewhan Kim (2012)

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DOI: 10.1109/ISOCC.2012.6407060

access: closed

type: Conference or Workshop Paper

metadata version: 2018-05-29

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Sangdo Park, Taewhan Kim:
Die matching algorithm for enhancing parametric yield of 3D ICs. ISOCC 2012: 143-146

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