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"A 3D Stackable 1T1C DRAM: Architecture, Process Integration and Circuit ..."

Meng Huang et al. (2023)

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DOI: 10.1109/IMW56887.2023.10145931

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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  - conf/imw2/HuangSHZLWLXYYC23
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Meng Huang, Shufang Si, Zheng He, Ying Zhou, Sijia Li, Hong Wang, Jinying Liu, Dongsheng Xie, Mengmeng Yang, Kang You, Chris Choi, Yi Tang, Xiaojie Li, Shibing Qian, Xiaodong Yang, Long Hou, Weiping Bai, Zhongming Liu, Yanzhe Tang, Qiong Wu, Yanqin Wang, Tao Dou, Jake Kim, Guilei Wang, Jie Baisp, Adachi Takao, Chao Zhao, Abraham Yoo:
A 3D Stackable 1T1C DRAM: Architecture, Process Integration and Circuit Simulation. IMW 2023: 1-4

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