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"A Heat Conduction Structure for the Etching Process of MEMS Devices with ..."

Jianjun Ma et al. (2022)

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DOI: 10.1109/SENSORS52175.2022.9967127

access: closed

type: Conference or Workshop Paper

metadata version: 2024-07-25

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  dblp key:
  - conf/ieeesensors/MaXCZ0Z22
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  - https://dblp.org/rec/conf/ieeesensors/MaXCZ0Z22
Jianjun Ma, Bowen Xing, Pu Chen, Bin Zhou, Qi Wei, Rong Zhang:
A Heat Conduction Structure for the Etching Process of MEMS Devices with Support Anchors. IEEE SENSORS 2022: 1-4

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