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"Thermal Scaffolding for Ultra-Dense 3D Integrated Circuits."

Dennis Rich et al. (2023)

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DOI: 10.1109/DAC56929.2023.10247815

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-05

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  dblp key:
  - conf/dac/RichKMRHYCM23
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  persistent URL:
  - https://dblp.org/rec/conf/dac/RichKMRHYCM23
Dennis Rich, Anna Kasperovich, Mohamadali Malakoutian, Robert M. Radway, Shiho Hagiwara, Takahide Yoshikawa, Srabanti Chowdhury, Subhasish Mitra:
Thermal Scaffolding for Ultra-Dense 3D Integrated Circuits. DAC 2023: 1-6

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