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"Contact testing of copper micro-pillars with very low damage for 3D IC ..."

Onnik Yaglioglu, Ben Eldridge (2013)

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DOI: 10.1109/3DIC.2013.6702361

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  - conf/3dic/YagliogluE13
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Onnik Yaglioglu, Ben Eldridge:
Contact testing of copper micro-pillars with very low damage for 3D IC assembly. 3DIC 2013: 1-4

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