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"Thermal correlation between measurements and FEM simulations in 3D ICs."

Papa Momar Souare et al. (2013)

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DOI: 10.1109/3DIC.2013.6702362

access: closed

type: Conference or Workshop Paper

metadata version: 2021-01-21

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  dblp key:
  - conf/3dic/SouareCFJFGBCCGLCTM13
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  persistent URL:
  - https://dblp.org/rec/conf/3dic/SouareCFJFGBCCGLCTM13
Papa Momar Souare, François de Crecy, Vincent Fiori, M. Haykel Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, Andras Borbely, Jean-Philippe Colonna, Perceval Coudrain, B. Giraud, C. Laviron, Séverine Cheramy, Clément Tavernier, Jean Michailos:
Thermal correlation between measurements and FEM simulations in 3D ICs. 3DIC 2013: 1-6

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