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"3D integration of standard integrated circuits."

Rene Puschmann et al. (2013)

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DOI: 10.1109/3DIC.2013.6702314

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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  dblp key:
  - conf/3dic/PuschmannBBWFJMZGOWLZ13
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  persistent URL:
  - https://dblp.org/rec/conf/3dic/PuschmannBBWFJMZGOWLZ13
Rene Puschmann, Mathias Bottcher, Irene Bartusseck, Frank Windrich, Conny Fiedler, Peggy John, Charles Alix Manier, Kai Zoschke, Jurgen Grafe, Hermann Oppermann, Jürgen Wolf, K. Dieter Lang, Michael Ziesmann:
3D integration of standard integrated circuits. 3DIC 2013: 1-7

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