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"Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system ..."

Amadine Jouve et al. (2015)

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DOI: 10.1109/3DIC.2015.7334553

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  - conf/3dic/JouveSGDCAABDFC15
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  - https://dblp.org/rec/conf/3dic/JouveSGDCAABDFC15
Amadine Jouve, Y. Sinquin, Arnaud Garnier, M. Daval, Pascal Chausse, M. Argoud, N. Allouti, Laurence Baud, Jérôme Dechamp, R. Franiatte, Séverine Cheramy, H. Kato, K. Kondo:
Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement. 3DIC 2015: TS1.4.1-TS1.4.8

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