default search action

combined dblp search
author search
venue search
publication search

ask others

"Thermal Stress Tracking in Multi-Die 3D Stacking Structure by Finite ..."

Cheong-Ha Jung, Won Seo, Gu-sung Kim (2019)

> Home

Details and statistics

DOI: 10.1109/3DIC48104.2019.9058848

access: closed

type: Conference or Workshop Paper

metadata version: 2020-04-19

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/3dic/JungSK19
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/JungSK19
Cheong-Ha Jung, Won Seo, Gu-sung Kim:
Thermal Stress Tracking in Multi-Die 3D Stacking Structure by Finite Element Analysis. 3DIC 2019: 1-2

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.