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"Characterization of local strain around trough silicon via interconnects ..."

Osamu Nakatsuka et al. (2011)

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DOI: 10.1109/3DIC.2012.6262971

access: closed

type: Conference or Workshop Paper

metadata version: 2020-10-25

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  - https://dblp.org/rec/conf/3dic/NakatsukaKKMNOZ11
Osamu Nakatsuka, Hideki Kitada, Young-Suk Kim, Yoriko Mizushima, Tomoji Nakamura, Takayuki Ohba, Shigeaki Zaima:
Characterization of local strain around trough silicon via interconnects in wafer-on-wafer structures. 3DIC 2011: 1-4

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