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"A 3D heterogeneous integration method using LTCC wafer for RF applications."

Xiaoyu Mi et al. (2011)

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DOI: 10.1109/3DIC.2012.6262955

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Xiaoyu Mi, Osamu Toyoda, Satoshi Ueda, Fumihiko Nakazawa:
A 3D heterogeneous integration method using LTCC wafer for RF applications. 3DIC 2011: 1-5

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