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Wei Huang 0004
Person information
- affiliation: AMD Research
- affiliation (former): IBM Austin Research Lab
- affiliation (former): University of Virginia
- affiliation (former): University of Science and Technology of China (USTC), Hefei, Anhui Province, China
Other persons with the same name
- Wei Huang — disambiguation page
- Wei Huang 0001 — Google, USA (and 1 more)
- Wei Huang 0002
— Institute of Southwestern Communication, Science and Technology on Communication Security Laboratory, Chengdu, China (and 2 more)
- Wei Huang 0003 — The Ohio State University, Columbus, USA
- Wei Huang 0005 — Virginia Tech, Blacksburg, USA
- Wei Huang 0006 — Huazhong University of Science and Technology, School of Management, Wuhan, China
- Wei Huang 0007
- Wei Huang 0008
- Wei Huang 0009
- Wei Huang 0010
- Wei Huang 0011
- Wei Huang 0012
- Wei Huang 0013
- Wei Huang 0014
- Wei Huang 0015
- Wei Huang 0016
- Wei Huang 0017
- Wei Huang 0018 — University of Westminster, UK (and 1 more)
- Wei Huang 0019 — University of Bedfordshire, UK (and 1 more)
- Wei Huang 0020
- Wei Huang 0021
- Wei Huang 0022
- Wei Huang 0023
- Wei Huang 0024 — Nanjing Institute of Technology, School of Computer Engineering, Nanjing, China
- Wei Huang 0025 — QIHOO 360, China (and 1 more)
- Wei Huang 0026 — University of Science and Technology of China, School of Computer Science and Technology, Hefei, China (and 1 more)
- Wei Huang 0027
- Wei Huang 0028 — Chinese Academy of Sciences, Key Laboratory of Wireless-Optical Communications, Hefei, China (and 1 more)
- Wei Huang 0029 — University of Windsor, Department of Electrical and Computer Engineering, Windsor, Canada
- Wei Huang 0030 — Beijing Institute of Technology, School of Computer Science, Beijing Laboratory of Intelligent Information Technology, China
- Wayne Huang 0001
- Wei Huang 0032 — Iowa State University, Department of Electrical and Computer Engineering, Ames, IA, USA
- Wei Huang 0033 — Tianjin University of Technology, School of Computer Science and Engineering, Engineering Research Center of Learning-Based Intelligent System, MOE Key Laboratory of Computer Vision and Systems, China (and 1 more)
- Wei Huang 0034
- Wei Huang 0035
- Wei Huang 0036
- Wei Huang 0037
- Wei Huang 0038
- Wei Huang 0039 — niversity of Science and Technology Beijing (and 1 more)
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2020 – today
- 2023
- [c27]Gabriel H. Loh
A Research Retrospective on AMD's Exascale Computing Journey. ISCA 2023: 81:1-81:14
2010 – 2019
- 2019
- [c26]Manish Arora, Matt Skach, Wei Huang, Xudong An, Jason Mars, Lingjia Tang, Dean M. Tullsen
Understanding the Impact of Socket Density in Density Optimized Servers. HPCA 2019: 687-700 - 2018
- [i1]Kapil Dev, Indrani Paul, Wei Huang, Yasuko Eckert, Wayne P. Burleson, Sherief Reda:
Implications of Integrated CPU-GPU Processors on Thermal and Power Management Techniques. CoRR abs/1808.09651 (2018) - 2017
- [j11]Yazhou Zu, Wei Huang, Indrani Paul
Ti-States: Power Management in Active Timing Margin Processors. IEEE Micro 37(3): 106-114 (2017) - [c25]Thiruvengadam Vijayaraghavan, Yasuko Eckert, Gabriel H. Loh, Michael J. Schulte, Mike Ignatowski, Bradford M. Beckmann, William C. Brantley, Joseph L. Greathouse, Wei Huang, Arun Karunanithi, Onur Kayiran, Mitesh R. Meswani, Indrani Paul
Design and Analysis of an APU for Exascale Computing. HPCA 2017: 85-96 - [c24]Abhinandan Majumdar, Leonardo Piga, Indrani Paul
Dynamic GPGPU Power Management Using Adaptive Model Predictive Control. HPCA 2017: 613-624 - 2016
- [c23]Brian Kocoloski, Leonardo Piga, Wei Huang, Indrani Paul
A Case for Criticality Models in Exascale Systems. CLUSTER 2016: 213-216 - [c22]Leonardo Piga, Indrani Paul
Performance Boosting Opportunities under Communication Imbalance in Power-Constrained HPC Clusters. ICPP 2016: 31-40 - [c21]Vignesh Adhinarayanan
Measuring and modeling on-chip interconnect power on real hardware. IISWC 2016: 23-33 - [c20]Kapil Dev, Sherief Reda, Indrani Paul
Workload-Aware Power Gating Design and Run-Time Management for Massively Parallel GPGPUs. ISVLSI 2016: 242-247 - [c19]Yazhou Zu, Wei Huang, Indrani Paul, Vijay Janapa Reddi:
Ti-states: Processor power management in the temperature inversion region. MICRO 2016: 55:1-55:13 - [c18]Kapil Dev, Indrani Paul, Wei Huang:
A framework for evaluating promising power efficiency techniques in future GPUs for HPC. SpringSim (HPS) 2016: 11 - 2015
- [c17]Abhinandan Majumdar, Gene Y. Wu, Kapil Dev, Joseph L. Greathouse, Indrani Paul
A Taxonomy of GPGPU Performance Scaling. IISWC 2015: 118-119 - [c16]Indrani Paul
Harmonia: balancing compute and memory power in high-performance GPUs. ISCA 2015: 54-65 - 2014
- [c15]Bo Su, Junli Gu, Li Shen, Wei Huang, Joseph L. Greathouse, Zhiying Wang:
PPEP: Online Performance, Power, and Energy Prediction Framework and DVFS Space Exploration. MICRO 2014: 445-457 - 2013
- [j10]Karthik Sankaranarayanan, Brett H. Meyer, Wei Huang, Robert J. Ribando, Hossein Haj-Hariri, Mircea R. Stan
Architectural implications of spatial thermal filtering. Integr. 46(1): 44-56 (2013) - 2012
- [j9]Kshitij Sudan, Karthick Rajamani, Wei Huang, John B. Carter:
Tiered Memory: An Iso-Power Memory Architecture to Address the Memory Power Wall. IEEE Trans. Computers 61(12): 1697-1710 (2012) - [c14]Cong Liu, Jian Li, Wei Huang, Juan Rubio, Evan Speight, Xiaozhu Lin:
Power-efficient time-sensitive mapping in heterogeneous systems. PACT 2012: 23-32 - [c13]Wei Huang, Charles Lefurgy, William Kuk, Alper Buyuktosunoglu, Michael S. Floyd, Karthick Rajamani, Malcolm Allen-Ware, Bishop Brock:
Accurate Fine-Grained Processor Power Proxies. MICRO 2012: 224-234 - 2011
- [j8]Wei Huang, Malcolm Allen-Ware, John B. Carter, Mircea R. Stan
Temperature-Aware Architecture: Lessons and Opportunities. IEEE Micro 31(3): 82-86 (2011) - [j7]Wei Huang, Karthick Rajamani, Mircea R. Stan
Scaling with Design Constraints: Predicting the Future of Big Chips. IEEE Micro 31(4): 16-29 (2011) - [c12]Wei Huang, Malcolm Allen-Ware, John B. Carter, E. N. Elnozahy, Hendrik F. Hamann, Tom W. Keller, Charles Lefurgy, Jian Li, Karthick Rajamani, Juan Rubio:
TAPO: Thermal-aware power optimization techniques for servers and data centers. IGCC 2011: 1-8 - [c11]Jian Li, Wei Huang, Charles Lefurgy, Lixin Zhang, Wolfgang E. Denzel, Richard R. Treumann, Kun Wang:
Power shifting in Thrifty Interconnection Network. HPCA 2011: 156-167 - 2010
- [c10]Zhenyu Qi, Brett H. Meyer, Wei Huang, Robert J. Ribando, Kevin Skadron
Temperature-to-power mapping. ICCD 2010: 384-389
2000 – 2009
- 2009
- [c9]Wei Huang, Kevin Skadron
Differentiating the roles of IR measurement and simulation for power and temperature-aware design. ISPASS 2009: 1-10 - 2008
- [j6]Wei Huang, Karthik Sankaranarayanan, Kevin Skadron
Accurate, Pre-RTL Temperature-Aware Design Using a Parameterized, Geometric Thermal Model. IEEE Trans. Computers 57(9): 1277-1288 (2008) - [c8]Wei Huang, Mircea R. Stan
Many-core design from a thermal perspective. DAC 2008: 746-749 - 2007
- [j5]Zhijian Lu, Wei Huang, Mircea R. Stan
Interconnect Lifetime Prediction for Reliability-Aware Systems. IEEE Trans. Very Large Scale Integr. Syst. 15(2): 159-172 (2007) - 2006
- [j4]Wei Huang, Shougata Ghosh, Sivakumar Velusamy, Karthik Sankaranarayanan, Kevin Skadron
HotSpot: A Compact Thermal Modeling Methodology for Early-Stage VLSI Design. IEEE Trans. Very Large Scale Integr. Syst. 14(5): 501-513 (2006) - [c7]Zhenyu Qi, Wei Huang, Adam C. Cabe, Wenqian Wu, Yan Zhang, Garrett S. Rose, Mircea R. Stan
A Design Methodology for a Low-Power, Temperature-Aware SoC Developed for Medical Image Processors. SoCC 2006: 111-112 - 2005
- [c6]Kyeong-Jae Lee, Kevin Skadron
Analytical Model for Sensor Placement on Microprocessors. ICCD 2005: 24-30 - [c5]Sivakumar Velusamy, Wei Huang, John C. Lach, Mircea R. Stan
Monitoring Temperature in FPGA based SoCs. ICCD 2005: 634-640 - [c4]Wei Huang, Eric Humenay, Kevin Skadron
The need for a full-chip and package thermal model for thermally optimized IC designs. ISLPED 2005: 245-250 - 2004
- [j3]Kevin Skadron
Temperature-aware microarchitecture: Modeling and implementation. ACM Trans. Archit. Code Optim. 1(1): 94-125 (2004) - [c3]Wei Huang, Mircea R. Stan
Compact thermal modeling for temperature-aware design. DAC 2004: 878-883 - [c2]Zhijian Lu, Wei Huang, John C. Lach, Mircea R. Stan
Interconnect lifetime prediction under dynamic stress for reliability-aware design. ICCAD 2004: 327-334 - 2003
- [j2]Kevin Skadron
Temperature-Aware Computer Systems: Opportunities and Challenges. IEEE Micro 23(6): 52-61 (2003) - [j1]Mircea R. Stan
HotSpot: a dynamic compact thermal model at the processor-architecture level. Microelectron. J. 34(12): 1153-1165 (2003) - [c1]Kevin Skadron, Mircea R. Stan
Temperature-Aware Microarchitecture. ISCA 2003: 2-13
Coauthor Index
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