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Hisashi Kino
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- affiliation: Tohoku University, Sendai, Miyagi, Japan
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Journal Articles
- 2022
- [j2]Yaogan Liang, Bang Du, Kohei Nakamura, Shengwei Wang, Bunta Inoue, Yuta Aruga, Hisashi Kino, Takafumi Fukushima
, Koji Kiyoyama, Tetsu Tanaka:
3D-stacked retinal prosthesis chip with binary image capture and edge detection functions for human visual restoration. IEICE Electron. Express 19(23): 20220363 (2022) - 2016
- [j1]Takafumi Fukushima
Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration. Micromachines 7(10): 184 (2016)
Conference and Workshop Papers
- 2024
- [c21]Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka:
Supression of TSV-Induced Stress by Using Negative Thermal Expansion Material. 3DIC 2024: 1-3 - 2023
- [c20]Jiayi Shen, Chang Liu, Tadaaki Hoshi, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, Mariappan Murugesan, Mitsumasa Koyanagi, Takafumi Fukushima
Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last. 3DIC 2023: 1-4 - [c19]Kohei Nakamura, Bang Du, Keishun Sugishita, Ryo Hasegawa, Hisashi Kino, Takafumi Fukushima
Development of Trans-nail PPG Controller Using Fingertip Blood Volume Changes to Enable Highly Accurate Motion Prediction. BioCAS 2023: 1-4 - 2022
- [c18]Kohei Nakamura, Yaogan Liang, Bang Du, Shengwei Wang, Yuta Aruga, Bunta Inoue, Hisashi Kino, Takafumi Fukushima
Implementation of Light and Dark Adaptation Function for High QOL 3D-Stacked Artificial Retina Chip. BioCAS 2022: 519-523 - 2021
- [c17]Takafumi Fukushima
Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing. 3DIC 2021: 1-4 - [c16]Yaogan Liana, Zhengyang Qian, Bang Du, Jinming Ye, Kohei Nakamura, Shengwei Wang, Hisashi Kino, Takafumi Fukushima
Design and Evaluation of Electronic-Microsaccade with Balanced Stimulation for Artificial Vision System. BioCAS 2021: 1-4 - 2019
- [c15]Hisashi Kino
Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System. 3DIC 2019: 1-4 - [c14]Koji Kiyoyama, Qian Zhengy, Hiroyuki Hashimoto, Hisashi Kino
Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing. 3DIC 2019: 1-4 - [c13]Sungho Lee, Yuki Susumago, Zhengyang Qian, Noriyuki Takahashi, Hisashi Kino
Development of 3D-IC Embedded Flexible Hybrid System. 3DIC 2019: 1-4 - [c12]Rui Liang, Sungho Lee, Yuki Miwa, Kousei Kumahara, Mariappan Murugesan, Hisashi Kino
Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO2 for Low-Temperature TSV Liner Formation. 3DIC 2019: 1-4 - [c11]Yuki Miwa, Sungho Lee, Rui Liang, Kousei Kumahara, Hisashi Kino
Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs. 3DIC 2019: 1-4 - [c10]Ryosuke Yabuki, Tetsu Tanaka
PPG and SpO2 Recording Circuit with Ambient Light Cancellation for Trans-Nail Pulse-Wave Monitoring System. BioCAS 2019: 1-4 - 2018
- [c9]Kar Mun Lee, Zhengyang Qian, Ryosuke Yabuki, Bang Du, Hisashi Kino
Continuous Peripheral Blood Pressure Measurement with ECG and PPG Signals at Fingertips. BioCAS 2018: 1-4 - 2017
- [c8]Kenji Shimokawa, Zhengyang Qian, Yoshiki Takezawa, Hisashi Kino
Experimental evaluation of stimulus current generator with Laplacian edge-enhancement for 3-D stacked retinal prosthesis chip. BioCAS 2017: 1-4 - [c7]Yoshiki Takezawa, Koji Kiyoyama, Kenji Shimokawa, Zhengyang Qian, Hisashi Kino
Ultrawide range square wave impedance analysis circuit with ultra-slow ring-oscillator using gate-induced drain-leakage current. BioCAS 2017: 1-4 - 2016
- [c6]Hisashi Kino
Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler. 3DIC 2016: 1-4 - [c5]Koji Kiyoyama, Yoshiki Takezawa, Tatsuya Goto, Keita Ito, Shoma Uno, Kenji Shimokawa, Satoru Nishino, Hisashi Kino
Wide-range and precise tissue impedance analysis circuit with ultralow current source using gate-induced drain-leakage current. BioCAS 2016: 304-307 - 2015
- [c4]Seiya Tanikawa, Hisashi Kino
Novel local stress evaluation method in 3D IC using DRAM cell array with planar mOS capacitors. 3DIC 2015: TS3.1.1-TS3.1.4 - [c3]Hisashi Kino
Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC. 3DIC 2015: TS8.26.1-TS8.26.4 - 2013
- [c2]Shota Kanno, Sang-Rim Lee, T. Harashima, Toshinobu Kuki, Hisashi Kino
Multiple optical stimulation to neuron using Si opto-neural probe with multiple optical waveguides and metal-cover for optogenetics. EMBC 2013: 253-256 - 2009
- [c1]Ji Chel Bea, Mariappan Murugesan, Yuki Ohara, Akihiro Noriki
Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. 3DIC 2009: 1-5
Coauthor Index
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