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"Supression of TSV-Induced Stress by Using Negative Thermal Expansion Material."

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka (2024)

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DOI: 10.1109/3DIC63395.2024.10830164

access: closed

type: Conference or Workshop Paper

metadata version: 2025-01-23

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Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka:
Supression of TSV-Induced Stress by Using Negative Thermal Expansion Material. 3DIC 2024: 1-3

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