Call for research papers

CONTEXT

The Systems and Software Product Line Conference (SPLC) is a premier forum where researchers, practitioners, and educators can present and discuss the most recent ideas, trends, experiences, and challenges in the area of software and system product lines engineering. Conference events include opportunities to hear industry leaders’ real-world experiences and researchers’ latest ideas, and to learn from both.

For the research track, we invite high quality submissions describing original and unpublished results in all areas related to systems and software product line engineering and variability management.

IMPORTANT DATES (AoE)

Abstract submission: ~~Mar 10, 2017~~ Mar 17, 2017 (extended)
Paper submission: ~~Mar 17, 2017~~ Mar 24, 2017 (extended)
Notification: May 10, 2017
Camera-ready papers: ~~June 5, 2017~~ Jun 22, 2017
Conference: Sept 25-29 , 2017

TOPICS
Topics include but are not limited to:

Requirements engineering and domain analysis
Business process management, economics and organizational issues of SPL engineering
Architecture, design, and implementation of SPLs
Variability management and modeling
Advances in testing (e.g. selection, prioritization, generation) of configurable systems and SPLs
Analysis techniques such as model-checking, formal methods of configurable systems and SPLs
Non-functional properties and performance for SPL engineering
Multi product lines, ecosystems product lines of product lines, systems of systems
Mining and reverse engineering of variability
Dynamic, adaptive, and reconfigurable systems
End-user concerns and usability of SPLs
Open source SPLs, software ecosystems, and supply chains
Domain-specific (modeling) languages and SPLs
Education and SPL (e.g., teaching, training, disemination)
Empirical evaluations of all topics above (user studies, substantial case studies, controlled experiments, surveys, rigorous measurements)

We strongly encourage papers that connect SPL engineering to other scientific communities (e.g., artificial intelligence, security, adaptive systems, business process management, software mining) or application domains (e.g., mobile phone ecosystems, big data, 3D printing).

SUBMISSIONS/PUBLISHING

Full papers describing original results of conceptual, theoretical, empirical, and experimental research. The papers in this category must rely on theoretical and/or empirical evaluation.
Short papers describing emerging ideas and outstanding challenges along with possible approaches for resolving them.

The page limit is 10 pages for full papers and 5 pages for short papers. Submissions must follow the ACM proceedings format and will be reviewed by at least three members of the SPLC 2017 research track program committee following high scientific standards.

The ACM styles have changed recently, and all authors should use the official 2017 ACM Master article template.

Latex users are indicated to use the “sigconf” option, so they are recommended to use the template that can be found in “sample-sigconf.tex”. In this way, the following latex code can be placed at the start of the latex document:

documentclass[sigconf]{acmart}

acmConference[SPLC'17]{21st International Conference on Software Product Line}{25--29 September, 2017}{Seville, Spain}

The SPLC proceedings will be published in the ACM Digital Library. SPLC is ranked as a top conference.

At least one author of each accepted submission must register and attend SPLC 2017 in order for the submission to be published.

Submissions should be sent using EasyChair: https://easychair.org/conferences/?conf=splc2017

CHAIRS

Myra Cohen, University of Nebraska-Lincoln
Mathieu Acher, Université of Rennes 1