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1.
SPIDR, a general-purpose readout system for pixel ASICs / van der Heijden, B (NIKHEF, Amsterdam) ; Visser, J (NIKHEF, Amsterdam) ; van Beuzekom, M (NIKHEF, Amsterdam) ; Boterenbrood, H (NIKHEF, Amsterdam) ; Kulis, S (CERN ; Gottingen U.) ; Munneke, B (NIKHEF, Amsterdam) ; Schreuder, F (NIKHEF, Amsterdam)
The SPIDR (Speedy PIxel Detector Readout) system is a flexible general-purpose readout platform that can be easily adapted to test and characterize new and existing detector readout ASICs. It is originally designed for the readout of pixel ASICs from the Medipix/Timepix family, but other types of ASICs or front-end circuits can be read out as well. [...]
2017 - 9 p. - Published in : JINST 12 (2017) C02040
In : Topical Workshop on Electronics for Particle Physics, Karlsruhe, Germany, 26 - 30 Sep 2016, pp.C02040
2.
SPIDR: a read-out system for Medipix3 & Timepix3 / Visser, J (NIKHEF, Amsterdam) ; Beuzekom, M van (NIKHEF, Amsterdam) ; Boterenbrood, Henk (NIKHEF, Amsterdam) ; Heijden, B van der (NIKHEF, Amsterdam) ; Muñoz, J I (NIKHEF, Amsterdam) ; Kulis, S (CERN) ; Munneke, B (NIKHEF, Amsterdam) ; Schreuder, F (NIKHEF, Amsterdam)
The realisation of the Timepix3 chip opened the way for new opportunities in research areas such as particle tracking with both semiconductor sensors and gas filled time projection chambers, electron microscopy and imaging mass spectrometry. To exploit the full capability of the Timepix3 chip, Nikhef developed a compact read-out system, called SPIDR that can deal with the high data output of 80 Mhits per chip per second. [...]
2015 - Published in : JINST 10 (2015) C12028 Fulltext: PDF;
In : 17th International Workshop on Radiation Imaging Detectors, Hamburg, Germany, 28 Jun - 02 Jul 2015, pp.C12028
3.
VeloPix: the pixel ASIC for the LHCb upgrade / Poikela, Tuomas (Turku U. ; CERN) ; De Gaspari, M (CERN) ; Plosila, J (Turku U.) ; Westerlund, T (Turku U.) ; Ballabriga, R (CERN) ; Buytaert, J (CERN) ; Campbell, M (CERN) ; Llopart, X (CERN) ; Wyllie, K (CERN) ; Gromov, V (NIKHEF, Amsterdam) et al.
The LHCb Vertex Detector (VELO) will be upgraded in 2018 along with the other subsystems of LHCb in order to enable full readout at 40 MHz, with the data fed directly to the software triggering algorithms. The upgraded VELO is a lightweight hybrid pixel detector operating in vacuum in close proximity to the LHC beams. [...]
2015 - Published in : JINST 10 (2015) C01057
In : 7th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging, Niagara Falls, Ontario, Canada, 1 - 5 Sep 2014, pp.C01057
4.
The VeloPix ASIC / Poikela, Tuomas (CERN) ; Ballabriga, R (CERN) ; Buytaert, J (CERN) ; Llopart, X (CERN) ; Wong, W (CERN) ; Campbell, M (CERN) ; Wyllie, K (CERN) ; van Beuzekom, M (NIKHEF, Amsterdam) ; Schipper, J (NIKHEF, Amsterdam) ; Miryala, S (NIKHEF, Amsterdam) et al.
VeloPix, a 130 nm CMOS technology chip with data driven and zero suppressed readout, will be used as a readout chip for the hybrid pixel system of the LHCb Vertex Locator (VELO) upgrade. The upgrade, scheduled for LHC Run-3, will enable the experiment to be read out at 40 MHz in trigger-less mode, with event selection being performed in the CPU farm. [...]
2017 - 8 p. - Published in : JINST 12 (2017) C01070
In : Topical Workshop on Electronics for Particle Physics, Karlsruhe, Germany, 26 - 30 Sep 2016, pp.C01070
5.
VeloPix ASIC for the LHCb VELO Upgrade
Reference: Poster-2016-515
Created: 2015. -1 p
Creator(s): Cid Vidal, Xabier

The LHCb Vertex Detector (VELO) will be upgraded in 2018 along with the other subsystems of LHCb in order to enable full detector readout at 40 MHz. LHCb will run without a hardware trigger and all data will be fed directly to the software triggering algorithms in the CPU farm. The upgraded VELO is a lightweight silicon hybrid pixel detector with 55 um square pixels, operating in vacuum in close proximity to the LHC beams. The readout will be provided by a dedicated front end ASIC, dubbed VeloPix, matched to the LHCb luminosity requirements. VeloPix is a binary pixel chip with a matrix of 256 x 256 pixels, covering an area of 2 cm^2. It is designed in a 130 nm CMOS technology, and is closely related to the Timepix3, from the Medipix family of ASICs. The principal challenge that the chip has to meet is a hit rate of up to 900 Mhits/s/ASIC, resulting in a data rate of more than 16 Gbit/s. Combining pixels into groups of 2x4 super-pixels enables the use of shared logic and a reduction of bandwidth due to combined address and timestamp information. The pixel hits are combined with other simultaneous hits in the same super-pixel, timestamped, and immediately driven off-chip via custom designed 5.12 Gbit/s serialisers. The power consumption of the analog front end is about 5 uW per pixel, and the total power consumption of the ASIC is less than 2 W. An extensive testbeam and lab test campaign is underway in order to characterise prototype upgrade VELO sensors and simultaneously study the performance of the Timepix3 chip in a high track rate environment. These measurements provide valuable input to the VeloPix project. The VeloPix ASIC design is nearing completion and the chip is expected to be submitted in the autumn. The current status of the ASIC design, performance simulations and prototyping will be described, along with recent lab and testbeam results.

Related links:
10th International "Hiroshima" Symposium on the Development and Application of Semiconductor Tracking Detectors; The VeloPix ASIC for the LHCb VELO Upgrade
© CERN Geneva

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6.
VeloPix ASIC development for LHCb VELO upgrade / van Beuzekom, M (NIKHEF, Amsterdam) ; Buytaert, J (CERN) ; Campbell, M (CERN) ; Collins, P (CERN) ; Gromov, V (NIKHEF, Amsterdam) ; Kluit, R (NIKHEF, Amsterdam) ; Llopart, X (CERN) ; Poikela, T (Turku U ; CERN) ; Wyllie, K (CERN) ; Zivkovic, V (NIKHEF, Amsterdam)
The upgrade of the LHCb experiment, planned for 2018, will transform the readout of the entire experiment to a triggerless system operating at 40 MHz. All data reduction algorithms will be run in a high level software farm, and will have access to event information from all subdetectors. [...]
2013 - 5 p. - Published in : Nucl. Instrum. Methods Phys. Res., A 731 (2013) 92-96
In : 6th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging, Inawashiro, Japan, 3 - 7 Sep 2012, pp.92-96
7.

CERN-PHOTO-201702-048
© 2017-2024 CERN
The Timepix3 chip developed at CERN and silicon wafer
Knowledge Transfer technologies : photos 1 to 3: T [...]
23-02-2017
More >>
8.
An introduction to the Medipix family ASICs / Ballabriga, R (CERN) ; Campbell, M (CERN) ; Llopart, X (CERN)
The first Medipix chip which aimed at permitting single photon counting on a sizable matrix of pixels was developed in the mid-1990's. In the following 20 years two families of chips have evolved from that initial effort. [...]
2020 - 3 p. - Published in : Radiat. Meas. 136 (2020) 106271 Fulltext from Publisher: PDF;
In : The Medipix/Timepix ASIC family and its applications, pp.106271
9.
The upgrade of the LHCb Vertex Locator (VELO) / van Beuzekom, M (NIKHEF, Amsterdam)
The upgrade of the LHCb experiment, planned for 2018, will enable the detector to run at a luminosity of 2 x 10$^{33}$ cm$^{-22}$s$^{-1}$ and explore New Physics effects in the beauty and charm sector with unprecedented precision. To achieve this, the entire readout will be transformed into a triggerless system operating at 40 MHz, where the event selection algorithms will be executed by high-level software in the CPU farm. [...]
LHCb-PROC-2014-008; CERN-LHCb-PROC-2014-008.- Geneva : CERN, 2014 - 10 p. - Published in : PoS: Vertex2013 (2013) , pp. 016 Fulltext: PDF;
In : 22nd International Workshop on Vertex Detectors, Lake Starnberg, Germany, 16 - 20 Sep 2013, pp.016
10.
Readout Architecture for Hybrid Pixel Readout Chips / Poikela, Tuomas Sakari
The original contribution of this thesis to knowledge are novel digital readout architectures for hybrid pixel readout chips [...]
CERN-THESIS-2015-111 - 209 p.

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