F28M35H52C
- Master Subsystem — Arm Cortex-M3
- Up to 100 MHz
- Embedded memory
- Up to 512KB of flash (ECC)
- Up to 32KB of RAM (ECC or parity)
- Up to 64KB of shared RAM
- 2KB of IPC Message RAM
- Five Universal Asynchronous Receiver/Transmitters (UARTs)
- Four Synchronous Serial Interfaces (SSIs) and a Serial Peripheral Interface (SPI)
- Two Inter-integrated Circuits (I2Cs)
- Universal Serial Bus On-the-Go (USB-OTG) + PHY
- 10/100 ENET 1588 MII
- Two Controller Area Network, D_CAN, modules (pin-bootable)
- 32-channel Micro Direct Memory Access (µDMA)
- Dual security zones (128-bit password per zone)
- External Peripheral Interface (EPI)
- Micro Cyclic Redundancy Check (µCRC) module
- Four general-purpose timers
- Two watchdog timer modules
- Three external interrupts
- Endianness: little endian
- Clocking
- On-chip crystal oscillator and external clock input
- Dynamic Phase-Locked Loop (PLL) ratio changes supported
- 1.2-V digital, 1.8-V analog, 3.3-V I/O design
- Interprocessor Communications (IPC)
- 32 handshaking channels
- Four channels generate IPC interrupts
- Can be used to coordinate transfer of data through IPC Message RAMs
- Up to 74 individually programmable, multiplexed General-Purpose Input/Output (GPIO) pins
- Glitch-free I/Os
- Control Subsystem — TMS320C28x 32-bit CPU
- Up to 150 MHz
- C28x core hardware built-in self-test
- Embedded memory
- Up to 512KB of flash (ECC)
- Up to 36KB of RAM (ECC or parity)
- Up to 64KB of shared RAM
- 2KB of IPC Message RAM
- IEEE-754 single-precision Floating-Point Unit (FPU)
- Viterbi, Complex Math, CRC Unit (VCU)
- Serial Communications Interface (SCI)
- SPI
- I2C
- 6-channel Direct Memory Access (DMA)
- Nine Enhanced Pulse Width Modulator (ePWM) modules
- 18 outputs (16 high-resolution)
- Six 32-bit Enhanced Capture (eCAP) modules
- Three 32-bit Enhanced Quadrature Encoder Pulse (eQEP) modules
- Multichannel Buffered Serial Port (McBSP)
- EPI
- One security zone (128-bit password)
- Three 32-bit timers
- Endianness: little endian
- Analog Subsystem
- Dual 12-bit Analog-to-Digital Converters (ADCs)
- Up to 2.88 MSPS
- Up to 20 channels
- Four Sample-and-Hold (S/H) circuits
- Up to six comparators with 10-bit Digital-to-Analog Converter (DAC)
- Package
- 144-Pin RFP PowerPAD™ Thermally Enhanced Thin Quad Flatpack (HTQFP)
- Temperature options:
- T: –40°C to 105°C Junction
- S: –40°C to 125°C Junction
- Q: –40°C to 125°C Free-Air (AEC Q100 qualification for automotive applications)
The Concerto family is a multicore system-on-chip microcontroller unit (MCU) with independent communication and real-time control subsystems. The F28M35x family of devices is the first series in the Concerto family.
The communications subsystem is based on the industry-standard 32-bit Arm Cortex-M3 CPU and features a wide variety of communication peripherals, including Ethernet 1588, USB OTG with PHY, Controller Area Network (CAN), UART, SSI, I2C, and an external interface.
The real-time control subsystem is based on TI’s industry-leading proprietary 32-bit C28x floating-point CPU and features the most flexible and high-precision control peripherals, including ePWMs with fault protection, and encoders and captures—all as implemented by TI’s TMS320C2000™ Entry performance MCUs and Premium performance MCUs. In addition, the C28-CPU has been enhanced with the addition of the VCU instruction accelerator that implements efficient Viterbi, Complex Arithmetic, 16-bit FFTs, and CRC algorithms.
A high-speed analog subsystem and supplementary RAM memory is shared, along with on-chip voltage regulation and redundant clocking circuitry. Safety considerations also include Error Correction Code (ECC), parity, and code secure memory, as well as documentation to assist with system-level industrial safety certification.
관심 가지실만한 유사 제품
비교 대상 장치와 유사한 기능
기술 자료
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
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TMDSEMU200-U — XDS200 USB 디버그 프로브
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TMDSEMU560V2STM-U — XDS560v2 시스템 추적 USB 디버그 프로브
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모든 XDS 디버그 프로브는 ETB(Embedded Trace Buffer)를 특징으로 하는 모든 ARM 및 DSP 프로세서에서 코어 및 시스템 추적을 지원합니다. 핀을 통한 추적의 경우 XDS560v2 PRO TRACE가 필요합니다.
XDS560v2는 MIPI HSPT 60핀 커넥터(TI 14핀, (...)
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CONTROLSUITE — controlSUITE™ 소프트웨어 제품군 C2000 ™ 마이크로컨트롤러용 소프트웨어 및 개발 툴
CCSTUDIO — Code Composer Studio integrated development environment (IDE)
Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications. Code Composer Studio is available for download across Windows®, Linux® and macOS® desktops. It can also (...)
지원되는 제품 및 하드웨어
이 설계 리소스는 이러한 범주의 제품 대부분을 지원합니다.
제품 세부 정보 페이지에서 지원을 확인하십시오.
-
parametric-filter DSP(디지털 신호 프로세서) -
parametric-filter Arm 기반 프로세서 -
parametric-filter MSP430 마이크로컨트롤러 -
parametric-filter C2000 실시간 마이크로컨트롤러 -
parametric-filter Arm 기반 마이크로컨트롤러 -
parametric-filter 신호 조절기 -
parametric-filter mmWave 레이더 센서 -
parametric-filter Zigbee 제품 -
parametric-filter Wi-Fi 제품 -
parametric-filter 스레드 제품 -
parametric-filter 기타 무선기술 -
parametric-filter Sub-1GHz 제품 -
parametric-filter 다중 프로토콜 제품 -
parametric-filter 블루투스 제품 -
parametric-filter 디지털 전원 격리 컨트롤러
UNIFLASH — UniFlash for most TI microcontrollers (MCUs) and mmWave sensors
UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.
UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)
지원되는 제품 및 하드웨어
제품
C2000 실시간 마이크로컨트롤러
Arm 기반 프로세서
산업용 mmWave 레이더 센서
차량용 mmWave 레이더 센서
MSP430 마이크로컨트롤러
Wi-Fi 제품
Arm Cortex-M4 MCU
Arm Cortex-M0+ MCU
Arm Cortex-R MCU
저전력 2.4GHz 제품
차량용 무선 커넥티비티 제품
Sub-1GHz 무선 MCU
MATHW-3P-SLEC — MathWorks MATLAB, Simulink, C2000 마이크로컨트롤러 블록세트 및 임베디드 코더
MATLAB Coder™, Simulink Coder™ 및 Embedded Coder®는 Code Composer Studio IDE를 사용하여 Texas Instruments™ (TI) C2000 (...)
C2000-3P-SEARCH — C2000 타사 검색 툴
TIDM-SOLAR-ONEPHINV — C2000™ 태양광 DA/AC 단상 인버터
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
HTQFP (RFP) | 144 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.