홈 마이크로컨트롤러(MCU) 및 프로세서 Arm 기반 프로세서
홈
마이크로컨트롤러(MCU) 및 프로세서
Arm 기반 프로세서

DM3730

활성

디지털 미디어 프로세서

지금 주문
데이터 시트
사용자 가이드
정오표

DM3730

활성
데이터 시트 지금 주문

제품 상세 정보

Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 800, 1000 Coprocessors GPU CPU 32-bit Graphics acceleration 1 3D Display type 2 LCD Protocols Ethernet Hardware accelerators 1 Image Video Accelerator, SGX Graphics Operating system Linux, RTOS Rating Catalog Operating temperature range (°C) -40 to 105
Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 800, 1000 Coprocessors GPU CPU 32-bit Graphics acceleration 1 3D Display type 2 LCD Protocols Ethernet Hardware accelerators 1 Image Video Accelerator, SGX Graphics Operating system Linux, RTOS Rating Catalog Operating temperature range (°C) -40 to 105
FCCSP (CBC) 515 196 mm² 14 x 14 FCCSP (CBP) 515 144 mm² 12 x 12 FCCSP (CUS) 423 256 mm² 16 x 16
  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.
  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging
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TI에서 제공하는 제한된 설계 지원

이 제품은 기존 프로젝트에 대해 TI에서 제한된 설계 지원을 제공합니다. 가능한 경우 제품 폴더에서 관련 자료, 소프트웨어 및 툴을 확인할 수 있습니다. 이 제품을 사용하는 기존 설계의 경우 TI E2ETM 지원 포럼에서 지원을 요청할 수 있지만, 이 제품에 대한 제한된 지원을 사용할 수 있습니다.

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
24개 모두 보기
유형 직함 날짜
* Data sheet DM3730, DM3725 Digital Media Processors datasheet (Rev. D) 2011/04/11
* Errata DM3730, DM3725 Digital Media Processors Silicon Errata (Revs 1.2, 1.1 & 1.0) (Rev. F) 2014/02/13
* User guide AM/DM37x Multimedia Device Technical Reference Manual (Silicon Revision 1.x) (Rev. R) 2012/09/24
Application note OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles 2019/03/20
Technical article Enabling Wi-Fi® and Bluetooth® connectivity on RTOS PDF | HTML 2016/04/13
Technical article Spring has sprung. A sale has sprung. PDF | HTML 2016/04/04
Application note Plastic Ball Grid Array [PBGA] Application Note (Rev. B) 2015/08/13
Technical article Selecting the right processor: WiLink 8 plug and play platforms PDF | HTML 2015/06/26
Application note PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A) 2013/11/01
User guide Delta for AM/DM37x Technical Reference Manual Version Q to Version R (Rev. Q) 2012/09/10
More literature DM37x Design Network Partners 2012/06/05
Application note TI OMAP4430 POP SMT Design Guideline (Rev. C) 2011/11/03
Application note Introduction to TMS320C6000 DSP Optimization 2011/10/06
Application note PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs 2011/06/15
Product overview DM3730 Product Bulletin 2010/09/07
Application note PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II 2010/06/23
Application note PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I 2010/06/23
Application note AM/DM37x Power Estimation Spreadsheet 2010/06/07
Application note AM/DM37x Overview 2010/06/03
Application note AM3715/03 Memory Subsystem 2010/06/03
Application note AM37x CUS Routing Guidelines 2010/06/03
Application note Setting up AM37x SDRC Registers 2010/06/03
User guide Flip Chip Ball Grid Array Package Reference Guide (Rev. A) 2005/05/23
Application note AN-1281 Bumped Die (Flip Chip) Packages (Rev. A) 2004/05/01

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

소프트웨어 개발 키트(SDK)

ANDROIDEVKIT-FROYO — Android FROYO - Dev Kit for DM37x (TI_Android_DevKit/02_02_00)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
DM3725 — 디지털 미디어 프로세서 DM3730 — 디지털 미디어 프로세서
다운로드 옵션
소프트웨어 개발 키트(SDK)

ANDROIDEVKIT-GINGERBREAD — Android GINGERBREAD 2.3 - Dev Kit for DM37x (TI_Android_GingerBread_2_3_DevKit_1_0)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
DM3725 — 디지털 미디어 프로세서 DM3730 — 디지털 미디어 프로세서
다운로드 옵션
소프트웨어 개발 키트(SDK)

LINUXDVSDK-DM37X — DM3730/3725 디지털 미디어 프로세서용 DVSDK(Linux 디지털 비디오 소프트웨어 개발 키트)

The Linux Digital Video Software Development Kit (DVSDK) for DaVinci™ processors provides everything developers need to evaluate and start developing on the DM37x Cortex™-A8 DSP+ARM® microprocessors. With the included Graphical User Interface (GUI)-based Matrix Application Launcher, launching (...)
View Options
드라이버 또는 라이브러리

TELECOMLIB — 텔레콤 및 미디어 라이브러리 - TMS320C64x+ 및 TMS320C55x 프로세서를 위한 FAXLIB, VoLIB 및 AEC/AER

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)
View Options
IDE, 구성, 컴파일러 또는 디버거

CCSTUDIO — Code Composer Studio integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® desktops. It can also (...)

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

이 설계 리소스는 이러한 범주의 제품 대부분을 지원합니다.

제품 세부 정보 페이지에서 지원을 확인하십시오.
시작 다운로드 옵션
소프트웨어 프로그래밍 도구

FLASHTOOL — FlashTool for AM35x, AM37x, DM37x and OMAP35x Devices

Flash Tool is a Windows-based application that can be used to transfer binary images from a host PC to TI Sitara AM35x, AM37x, DM37x and OMAP35x target platforms.


Additional Information:

TI GForge - Welcome to gforge.ti.com

TI E2E Community

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
Arm 기반 프로세서
AM3505 — Sitara 프로세서: Arm Cortex-A8, 비디오 프론트 엔드 AM3517 — Sitara 프로세서: Arm Cortex-A8, 3D 그래픽, 비디오 프론트 엔드 AM3703 — Sitara 프로세서: Arm Cortex-A8, 카메라 AM3715 — Sitara 프로세서: Arm Cortex-A8, 3D 그래픽, 카메라 DM3725 — 디지털 미디어 프로세서 DM3730 — 디지털 미디어 프로세서 OMAP3503 — Sitara 프로세서: Arm Cortex-A8, LPDDR OMAP3515 — Sitara 프로세서: Arm Cortex-A8, 3D 그래픽, LPDDR OMAP3525 — 애플리케이션 프로세서 OMAP3530 — 애플리케이션 프로세서
다운로드 옵션
시뮬레이션 모델

AM/DM37x CBC BSDL Model (Rev. B)

SPRM507B.ZIP (8 KB) - BSDL Model
다운로드
시뮬레이션 모델

AM/DM37x CBC IBIS Model

SPRM510.ZIP (4410 KB) - IBIS Model
다운로드
시뮬레이션 모델

AM/DM37x CBP BSDL Model

SPRM506.ZIP (9 KB) - BSDL Model
다운로드
시뮬레이션 모델

AM/DM37x CBP IBIS Model

SPRM509.ZIP (4408 KB) - IBIS Model
다운로드
시뮬레이션 모델

AM/DM37x CUS BSDL Model

SPRM508.ZIP (10 KB) - BSDL Model
다운로드
시뮬레이션 모델

AM/DM37x CUS IBIS Model

SPRM511.ZIP (4255 KB) - IBIS Model
다운로드
레퍼런스 디자인

TIDA-00408 — 빌딩 자동화 및 의료 애플리케이션을 위한 햅틱 피드백 커패시티브 터치 디스플레이 레퍼런스 디자인

The TIDA-00408 Touch Display with Haptic Feedback reference design showcases haptics for thermostats, building automation, factory automation, point of sale, and automotive applications.  The touch screen provides touch feedback when the user interacts with the on-screen user interface.  (...)
Design guide: PDF
회로도: PDF
패키지 핀 CAD 기호, 풋프린트 및 3D 모델
FCCSP (CBC) 515 Ultra Librarian
FCCSP (CBP) 515 Ultra Librarian
FCCSP (CUS) 423 Ultra Librarian
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

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품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

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