In this case study, a Tier 1 telecommunications equipment OEM found that no matter how many heat sinks their new design had, it was still overheating and ceasing operations.
ATS was brought in to help identify the hot spots and determine a solution. Using our 3-Core Design Process ATS engineered a solution with optimal heat sink removal, design and placement.
ATS’ solution removed 16 heat sink from the customers PCB board, replacing them with turbulators and eight high-efficiency heat sinks. ATS’ U.S. based quick turn prototype shop was able to turn prototypes of the necessary pieces in 48 hours.
The customer’s board then met the thermal target the customer’s engineering team had set. Another big benefit of this program was that we saved the customer 40% off the BOM cost since our design removed 16 heat sinks. Production started soon after.
We’d really like to be involved with your current or next project for thermal management, click the orange button and let us know how we can help:
